Process Stage

Equipment / Technology

Key Specifications & Capabilities

Solder Paste Printing

Automatic Stencil Printers (Multiple Lines)

Vision Alignment (Fiducial & Pad Recognition), 2D/3D Solder Paste Inspection (SPI) integrated, Automatic stencil under-cleaning. Squeegee pressure & speed control.

Component Placement

High-Speed Chip Shooters

Speed: Up to 45,000 Components Per Hour (CPH). Feeder Capacity: 120+ slots per line. Placement Accuracy: ±0.05 mm. Components: 01005 (0402 metric), 0201, resistors, capacitors, small ICs.

Multi-Function / Fine-Pitch Placers

Speed: Up to 15,000 CPH. Accuracy: ±0.025 mm. Capable of: μBGA, 0.3mm pitch QFN, 0.4mm pitch CSP, POP (Package-on-Package), Connectors, Odd-form components. Up to 30mm component height.

Reflow Soldering

Nitrogen-Capable Convection Reflow Ovens

8-12 heating zones, 2 cooling zones. Closed-loop nitrogen environment (O₂ < 1000 ppm) for optimal solder joint quality, especially with low-residue/no-clean pastes. Full thermal profiling capability.

In-Line Inspection

3D Automated Optical Inspection (AOI)

Post-reflow inspection. Checks: presence, polarity, value, solder joint quality (bridging, insufficient, tombstoning).

Support

Automated Glue Dispensing, Selective Soldering, Conformal Coating Lines

Available for mixed-technology and specific reliability requirements.

Parameter

Standard Capability

Advanced / High-Precision Capability

Minimum Component Size

0201 (0.6mm x 0.3mm) / 01005 (0.4mm x 0.2mm)

01005 standard placement.

Fine-Pitch Placement

0.3 mm pitch BGA/CSP/QFN

0.25 mm pitch (subject to DFM review).

Ball Grid Array (BGA)

0.3mm ball pitch, μBGA

0.25mm pitch. X-Ray inspection standard for all BGAs.

Package-on-Package (PoP)

Fully Supported

Bottom and top package placement and reflow.

Placement Accuracy

±0.05 mm (50μm) for chip components. ±0.035 mm (35μm) for fine-pitch/ICs.

Stencil Thickness Range

0.08 mm (3 mil) to 0.15 mm (6 mil)

Laser-cut, electroformed, or nano-coated stencils. Step-stencils for mixed technology.

Solder Paste Type

No-Clean, Water-Soluble, Halogen-Free. SAC305, SnPb, and low-temperature alloys (BiSn).

System

Capability & Process

Component Packaging

Tape & Reel (EIA-481), Tube, Tray, Loose (for odd-form). BGA: Moisture-Sensitive Bag (MSD) with humidity indicator.

Feeder System

Automated, high-reliability feeders for 8mm, 12mm, 16mm, 24mm, 32mm, 44mm, 56mm, 72mm, and 84mm tapes. Tray feeders for QFP, BGA.

Inventory & Traceability

Barcode Scanner at all critical stages (kitting, loading, placement). Material tracking from warehouse to board. ERP/MES System integrated for full lot traceability.

ESD & Moisture Control

ESD-Safe workstations throughout. Dedicated MSD (Moisture Sensitive Device) storage with humidity control (<10% RH for dry cabinets). Baking ovens per IPC/JEDEC J-STD-033.

Solder Paste Management

Refrigerated storage. Automatic paste mixing and viscosity control. Solder paste life and expiration tracking.

Test/Inspection Type

Equipment / Method

Purpose & Standard

Pre-Production

DFM (Design for Manufacturability) Review

In-depth analysis of Gerber, BOM, and Pick&Place files to prevent assembly issues.

In-Process

2D/3D Solder Paste Inspection (SPI)

Measures paste volume, height, area, and alignment post-printing. Prevents defects before placement.

Post-Reflow

3D Automated Optical Inspection (AOI)

100% board inspection for component and solder joint defects.

Post-Reflow (BGA/QFN)

2D/3D X-Ray Inspection (AXI)

Standard for all BGA assemblies. Inspects hidden solder joints for voids, bridging, and ball alignment.

Electrical Test

Flying Probe Test, ICT (In-Circuit Test), FCT (Functional Test)

Validates electrical performance, connectivity, and functionality. Fixture design service available.

Microsection & Solder Joint Analysis

Cross-Sectioning Lab

Destructive analysis to verify solder joint integrity, intermetallic compound (IMC) formation, and process health per IPC-J-STD-001.

Compliance & Standards

IPC-A-610 (Acceptability), IPC-J-STD-001 (Soldering), IPC-7711/21 (Rework).

Certified IPC Trainers on staff. Workmanship to Class 2 (Standard) and Class 3 (High-Reliability).

Process

Capability Description

Through-Hole Technology (THT)

Selective Soldering for mixed SMT/THT boards, Wave Soldering for high-volume pure THT, and Manual Soldering for prototypes and rework.

Conformal Coating

Selective Robotic Spraying and manual brushing/dipping. Coatings: Acrylic (AR), Silicone (SR), Urethane (UR), Parylene (upon request). Masking and inspection services.

Potting & Encapsulation

For mechanical protection and environmental sealing of specific board areas.

Box Build & Final Assembly

Integration of PCBA into enclosures, wiring harness attachment, software loading, final product testing, and packaging.

Rework & Repair

Hot Air Rework Stations with bottom pre-heaters for BGA removal and replacement. Micro-rework for fine-pitch components. Performed by IPC-certified technicians.

Programming & Functional Test

In-circuit programming (ICSP), firmware loading, and customized functional test rig development and execution.

Aspect

Capability

Production Volume

Prototype (1-10 pcs), Low-Volume (10-1,000 pcs), Medium to High-Volume (1k-100k+ pcs).

Board Size Range

Min: 50mm x 50mm. Max: 500mm x 500mm (subject to equipment fixturing).

Board Thickness

0.4mm (Flex/Rigid-Flex) to 4.0mm (Heavy Copper).

Lead Time

Standard: 10-15 business days for turnkey (PCB+Assembly). Expedited: 3-7 business days available.