SMT PCB Assembly Supplier

Our Commitment to Your Success

First-Pass Yield Excellence

We consistently achieve>99.5% placement accuracy and maintain defect rates below 10,000 PPM through our closed-loop process control.

Complex Component Mastery

Our expertise spans from ultra-miniature 01005 and 0201 packages to advanced BGAs, QFNs, and PoP (Package-on-Package) configurations.

True Partnership

We assign a dedicated New Product Introduction (NPI) Engineer to every project, ensuring a seamless transition from design to mass production.

Our SMT Assembly Capabilities&Specifications

We invest in state-of-the-art equipment and process expertise to handle your most demanding projects.

Capability Parameter	Our Range&Specification	Technical Advantage
Component Size Range	01005(0.4mm x 0.2mm)to 55mm x 55mm	Handles the full spectrum of modern components.
IC Package Compatibility	BGA, CSP, QFN, DFN, LGA, PoP, COB	Specialized profiles for each package ensure optimal solder joint integrity.
Minimum Pin Pitch	0.2mm(8 mil)	High-precision vision systems and fine-paste printing capability.
Board/Panel Size	Min:50mm x 50mm	Max:510mm x 460mm （Flexible production lines for any form factor）
Placement Speed	Up to 150, 000 Components Per Hour(CPH)	High-speed lines equipped with multi-nozzle heads for optimal throughput.
Solder Paste Inspection	3D Laser SPI	100%inspection for paste volume, height, and alignment to prevent defects at the source.
Automated Optical Inspection	3D AOI with AI-Powered Algorithms	Superior defect detection(bridges, tombstoning, missing parts)with low false-call rates.
X-Ray Inspection	2D/3D AXI for Hidden Joints	Mandatory for BGA, QFN, and underfill inspection to ensure perfect hidden connections.

Your Reliable SMT PCB Assembly Supplier

Choosing the right SMT PCB Assembly Supplier is essential for maintaining solder joint quality, component accuracy, production consistency and delivery reliability. SENTAK provides surface mount PCB assembly services for prototypes, new product introduction and volume production.

Our service covers the complete SMT assembly process, including engineering review, solder paste printing, automated component placement, reflow soldering, inspection, electrical testing and final packaging.

Customers can work with SENTAK for:

SMT PCB prototype assembly
Low-, medium- and high-volume production
Fine-pitch component assembly
BGA, QFN, CSP, LGA and DFN assembly
Single- and double-sided SMT assembly
Rigid, flex and rigid-flex PCB assembly
Lead-free and RoHS-compliant assembly
Component sourcing and BOM management
Turnkey and consignment assembly
Programming and functional testing
Conformal coating and potting
Box build and system integration

As an experienced SMT PCB Assembly Supplier, SENTAK supports customers from initial DFM review through repeat production, helping reduce assembly risks before boards enter the manufacturing line.

Design for Excellence(DFX):SMT Best Practices

Leverage our engineering insight to design boards that are not only functional but also optimized for manufacturability, yield, and long-term reliability.

Key Recommendations for Robust SMT Design:

Pad&Stencil Design: Provide non-solder mask defined(NSMD)pads for BGAs.Follow industry-standard stencil aperture ratios to prevent solder bridging or insufficient volume.

Component Spacing: Maintain adequate clearance between components for unobstructed pick-and-place and inspection head movement.

Thermal Balance: Symmetric thermal relief connections on SMD pads connected to large copper planes to prevent"tombstoning"or skewed components during reflow.

Fiducials&Board Support: Include global and local fiducials for precise machine vision alignment.Ensure panels have adequate rails and tooling holes for stable transport.

Our Multi-Stage Quality Assurance Process

Quality is engineered into every step,not just inspected at the end.

Incoming Material Verification: All components are checked against the BOM and subjected to visual or electrical sampling.

Process Control at Source: 3D SPI validates solder paste deposition before placement.

Pre-Reflow Verification: AOI after placement catches missing or misaligned components.

Post-Reflow Inspection: 3D AOI and selective X-Ray inspect the final solder joints for perfection.

Functional Validation: Flying Probe Test(FPT),In-Circuit Test(ICT),or Functional Test(FCT)as per your requirements.

Final Audit&Packaging: Visual audit and anti-static,vacuum-sealed packaging for safe shipping.

Trusted Across Advanced Industries

Our precision SMT assembly processes meet the stringent standards of sectors where failure is not an option.

Automotive Electronics: ADAS modules,sensor ECUs,infotainment systems(IATF 16949 Certified Processes).

Medical Devices: Diagnostic equipment,patient monitors,wearable health tech(ISO 13485 Framework).

Industrial Electronics: Process controls,robotics,power conversion systems.

Telecommunications: 5G infrastructure,network switches,and routers.

Consumer Technology: High-density IoT devices and advanced wearables.

FAQ-SMT PCB Assembly Supplier

What is SMT PCB assembly?

SMT PCB assembly is the process of mounting electronic components directly onto the surface of a printed circuit board. Solder paste, automated placement equipment and reflow soldering are commonly used to complete the assembly.

Can SENTAK provide both PCB fabrication and SMT assembly?

Yes. Customers can combine PCB fabrication, component sourcing, SMT assembly, inspection and testing into one turnkey PCBA project.

Do you accept small prototype orders?

Yes. Prototype SMT assembly can be used for engineering validation, functional testing and new product introduction before volume production.

Can you assemble customer-supplied components?

Yes. SENTAK supports consignment and partial turnkey assembly. Customers can provide all components or only selected parts according to their procurement requirements.

Can you assemble BGA and QFN components?

Yes. BGA, QFN and other bottom-terminated components can be assembled. X-ray inspection may be used to check hidden solder joints according to project requirements.

What affects SMT PCB assembly cost?

The main cost factors include board quantity, component count, component package, single- or double-sided assembly, stencil requirements, BOM sourcing, inspection, testing, programming and delivery schedule.

Do you provide functional testing?

Functional testing can be provided according to customer-supplied test procedures, fixtures, firmware and acceptance criteria.

How can I reduce SMT assembly lead time?

Provide complete and consistent Gerber files, BOMs, centroid data and assembly drawings. Using readily available components and approving substitutions early can also help avoid procurement delays.

Looking for an SMT PCB Assembly Supplier for a prototype or volume production project?

Send SENTAK your Gerber files, BOM, centroid data, assembly drawings and testing requirements. Our engineering team will review the project and provide an SMT PCB assembly quotation based on the component package, order quantity, sourcing scope and testing requirements.

Start Your SMT Assembly Project