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Standard & Multilayer PCBs: Dependable PCBs, Great Value

From simple 2-layer boards to complex 12+ layer designs, we deliver the manufacturing consistency and quality that form the backbone of your products

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Standard & Multilayer PCBs
Standard & Multilayer PCBs
Standard & Multilayer PCBs
Standard & Multilayer PCBs
Standard & Multilayer PCBs
Standard & Multilayer PCBs
Standard & Multilayer PCBs

Standard & Multilayer PCBs

24-Hour Quick-Turn Prototypes

Expedited High-Volume Production

100%Testing&Quality Guarantee

On-Time Delivery Promise

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The Unmatched Value of Standard PCB Technology

Multilayer pcb fabrication consist of three or more conductive copper layers separated by insulating materials like prepreg and core, laminated into a single board. Their high component density and compact form factor make them critical for advanced electronic systems, power management, and signal shielding.

While advanced technologies like HDI and Rigid-Flex capture headlines, Standard Multilayer PCBs remain the workhorse of the electronics industry, enabling the vast majority of consumer, industrial, and automotive applications. Utilizing mature FR-4 materials and proven processes, they offer the optimal balance of electrical performance, mechanical reliability, and cost-effectiveness. At SENTAK, we excel in manufacturing these foundational components with unwavering precision, ensuring your design is built on a platform of absolute reliability.

 

Why Standard&Multilayer PCBs?

Proven Reliability

Decades of industry use have refined the materials and processes, resulting in predictable, long-term performance.

Design Flexibility

From 2-layer simplicity to 20+layer complexity, they accommodate a vast range of circuit densities and functionalities.

Supply Chain Stability

FR-4 materials and standard processes ensure robust supply chains and predictable lead times.

Cost Efficiency

They provide the most economical path to realizing complex circuitry, especially in medium to high volumes.

Our Standard & Multilayer PCB Manufacturing Capabilities

We combine advanced equipment with deep process expertise to deliver boards that meet stringent specifications, batch after batch.

 

Core Technical Specifications of Multilayer PCB Fabrication:

 

Parameter

Capability Range

Key Benefit

Layer Count

2 to 20+ Layers

Handles everything from simple interconnects to complex, high-speed digital designs.

Board Thickness

0.4mm to 3.2mm

Supports rigid designs for standard applications.

Material

FR-4 Standard & High Tg, Halogen-Free

Balanced performance for most electrical and thermal needs.

Minimum Trace/Space

3/3 mil (0.075/0.075 mm)

Enables good signal integrity and routing density.

Finished Copper Weight

1/2 oz to 4 oz (Inner/Outer)

Suitable for standard power and signal routing.

Surface Finish

HASL (Lead-Free), ENIG, Immersion Tin, OSP

Multiple options for solderability and shelf life.

Max Panel Size

600mm x 450mm

Efficient panelization for optimal manufacturing cost.

 

Advanced Features of multilayer pcb design We Support:

Controlled Impedance: For critical signal paths in digital and RF circuits.

Blind/Buried Vias (in Multilayer): For increased routing density in complex designs.

Heavy Copper (up to 4 oz): For enhanced current carrying within a standard stack-up.

Design for Success: Optimizing Your Standard PCB

Adhering to standard design rules maximizes manufacturability, yield, and reliability while minimizing cost.

Recommended Design Parameters Table:

 

Design Feature

Recommended Value (for Optimal Cost/Yield)

Advanced Value (Increases Cost/Time)

Minimum Trace/Space

5/5 mil (0.127mm)

3/3 mil or less

Minimum Annular Ring

6 mil (0.15mm)

4 mil (0.10mm)

Minimum Drill Size

0.25mm (10 mil)

0.15mm (6 mil)

Copper-to-Edge Clearance

0.50mm (20 mil)

0.25mm (10 mil)

 

Key Multilayer PCB Design Tips:

Utilize Symmetry: A symmetrical layer stack-up(copper distribution,materials)minimizes the risk of board warpage.

Define Clear Requirements: Always include a fabrication drawing specifying material,finished thickness,copper weight,and impedance controls.

Engage Early: Use our Free DFM Service to have our engineers review your design files before production,identifying potential issues and optimization opportunities.

 

Quality Assured: From Prototype to Volume

Our commitment to quality is embedded in every step, ensuring consistency whether you order ten prototypes or ten thousand production boards.

Certified Processes

Certified Processes

Manufacturing and inspection comply with IPC-6012 Class 2/3 and UL standards.

Comprehensive Testing

Comprehensive Testing

100%Electrical Test(Flying Probe or Fixture),Automated Optical Inspection(AOI).

Seamless Scaling

Seamless Scaling

Identical processes and quality checks from your first prototype to full-scale production, eliminating performance surprises.

Full Documentation:

Full Documentation:

Certificates of Conformance(CoC), IPC-2611 packings lists,and test reports provided.

Your Design Deserves Our Discipline.

Partner with a manufacturer where quality is a measurable, managed outcome.

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