PCB & PCBA Testing

In electronics manufacturing, testing is not a final checkpoint but an integrated engineering discipline woven into the entire production lifecycle. Effective PCB and PCBA testing de-risks your project by identifying failures early—from bare board fabrication flaws to assembly defects and functional inconsistencies. At SENTAK, our testing services are designed to deliver more than a pass/fail result; they provide actionable data on process health and product reliability, ensuring your products perform as designed under real-world conditions.

We employ a tiered testing strategy, applying the right inspection method at the right stage to maximize coverage and cost-efficiency.

Testing Strategy Matrix:

Inspection&Automated Optical Testing

3D SPI: Validates solder paste deposition with micron-level precision to prevent the majority of solder defects at the source.

3D AOI: Utilizes high-resolution cameras and advanced algorithms to detect assembly defects with over 99%coverage, minimizing false calls.

2D/3D X-Ray(AXI): Essential for modern packages. We analyze solder ball voids(<25%area typical), head-in-pillow defects, and internal PCB layer alignment.

Electrical&Functional Testing

Flying Probe Test: Ideal for prototypes and low/medium volumes. Tests net continuity, insulation, and basic component functionality without costly fixtures.

In-Circuit Test(ICT): For high-volume production. We design and build custom bed-of-nails fixtures to provide deep, nodal-level testing of every component on the board in seconds.

Functional Test(FCT): We develop custom test racks that simulate the final product’s operating environment—powering up the board, injecting signals, and measuring responses against specifications.

Specialized&Reliability Testing

Boundary Scan(JTAG): For testing complex digital circuitry and programming flash memory.

Signal Integrity Testing: TDR for impedance verification, high-speed serial data validation.

Environmental Stress Screening(ESS):Temperature cycling, power cycling, and vibration testing to precipitate and catch early-life failures.

There is no one-size-fits-all test plan.We collaborate with you to define the right balance of coverage,cost,and throughput.

Guiding Questions for Your Project:

Volume&Mix: Is this for prototype validation or high-volume production?

Board Complexity: Does it contain BGAs,microBGAs,or other hidden-joint components?

Risk Profile: What is the cost of failure in your application(consumer,automotive,medical)?

Data Needs: Do you require traceability data for each unit or batch?

A Typical SENTAK Test Flow:

Bare Board Test → SPI → AOI → X-Ray (for BGAs) → Flying Probe / ICT → Functional Test (FCT) → Final Audit

Our testing delivers more than quality control—it enables quality assurance.

Process Feedback Loops: SPI and AOI data are fed back to the SMT process engineers for real-time calibration, preventing defect recurrence.

Design for Testability(DFT)Consultation: We advise on adding test points, connector choices, and board layout to make your design more testable, reducing overall project cost.

Comprehensive Reporting: Receive detailed test logs, defect Pareto charts, and yield reports that provide insight into your product’s manufacturing health.