6L HDI PCB

6-Layer HDI PCB with Ultra-Fine Signal Integrity & High-Density Interconnect

Engineered for advanced high-speed digital and RF applications requiring precision impedance control, exceptional layer density, and reliable performance in compact form factors.

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Key Product Highlights

High-Density Interconnect (HDI) Architecture

6-layer stack-up with ultra-fine 3.2/3.2 mil trace/space enables superior routing density and supports high-pin-count components such as fine-pitch BGAs and advanced processors.

Laser-drilled microvias(0.1mm)+Blind/Buried vias+VIPPO(Via-in-Pad Plated Over) minimize signal path length,reduce via stub effects,and enhance signal integrity in high-speed designs.

Optimized for High-Speed&Controlled Impedance

Uniform thin inner-layer copper(0.5 oz) allows precise impedance matching and reduces signal attenuation,ideal for RF,microwave,and high-speed digital circuits.

0.8mm overall thickness provides excellent electrical performance while maintaining a slim,space-saving profile.

High-Temperature Reliability

FR4 TG170 substrate ensures mechanical and thermal stability(Tg≥170°C),suitable for lead-free assembly and demanding operating environments.

Enhanced Surface Finish

Immersion Gold(ENIG)with 2µ″Au delivers a flat,corrosion-resistant surface for reliable soldering,wire bonding,and consistent contact performance.

Why Choose This PCB?

Ideal for high-frequency and high-speed designs requiring tight impedance control and minimal signal loss.

Enables miniaturization without sacrificing layer capability —perfect for compact,high-performance electronics.

Supports advanced packaging technologies including chip-on-board and high-density interposers.

Target Applications

5G communication modules&RF front ends

High-speed networking equipment&data centers

Advanced medical imaging&diagnostic devices

Aerospace avionics&radar systems

High-performance computing&AI accelerators