4-Layer Ultra-Thin Rigid-Flex PCB

Engineered for high-density,dynamic applications where space,weight,and reliability are critical

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Key Product Highlights

Advanced Rigid-Flex Architecture with High-TG Material

Combines FR4 TG170 with Polyimide–TG170 provides superior thermal resistance(≥170°C),ensuring stability during lead-free soldering and high-temperature operation,while polyimide enables reliable flexibility.

True hybrid rigid-flex construction eliminates interconnects,reduces points of failure,and supports complex 3D packaging.

Extreme Thinness&Precision Flex Design

Ultra-thin flex areas:0.13mm–enables tight bending radii and repeated flexing,ideal for compact and moving assemblies.

Rigid sections:0.8mm–maintains structural integrity for component mounting and mechanical support.

Optimized for high-density layouts with 5.9/3.14 mil line/space, supporting fine-line routing and impedance control in both rigid and flex zones.

Reliable Interconnections&Assembly Readiness

Min.hole size: 0.2mm–allows for reliable micro-vias and interlayer connections in constrained layouts.

Heavier gold thickness:2µ″Immersion Gold(ENIG)–enhances corrosion resistance,improves wire bonding capability,and ensures robust solder joints,especially important in flexing interface areas.

Key Advantages for Demanding Applications

Superior thermal and mechanical performance due to high-TG FR4 and durable polyimide.

Enables lighter,thinner,and more reliable products by replacing cables and connectors with integrated flex circuits.

Ideal for high-vibration,high-flex,or space-constrained environments.

Ideal Use Cases

Wearable health monitors and medical patches

Miniaturized consumer electronics(foldable phones,compact cameras)

Aerospace instrumentation and drone avionics

Automotive sensors and control units in tight spaces

Robotics and precision industrial equipment