6L Hybrid Material HDI PCB

Engineered for high-frequency performance and dense integration in demanding RF and high-speed digital applications.

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Key Product Highlights

Advanced Hybrid Material Construction

Combines FR4 S1000-2M with Rogers 4350B in a unified stack-up,optimizing both electrical performance and cost efficiency.

Rogers 4350B layers provide stable dielectric constant and low loss for critical RF/high-frequency circuits.

FR4 S1000-2M layers offer reliable mechanical support and are ideal for digital and power routing.

High-Density Interconnect(HDI)Ready

6-layer architecture with 1 oz copper throughout ensures uniform current distribution and thermal management.

Supports complex routing and component placement with 7.8/5 mil line/space capability.

Min.hole size:0.25mm facilitates micro-vias and enhanced layer-to-layer interconnection density.

Precision-Engineered for Signal Integrity

Hybrid material design minimizes signal loss and cross-talk in mixed-signal and RF designs.

Controlled board thickness: 1.6mm provides mechanical stability while meeting impedance control requirements.

Reliable Surface Finish

Immersion Gold(ENIG)with 1µ″Au offers excellent solderability,surface planarity,and corrosion resistance—ideal for fine-pitch components and wire bonding.

Why Choose This Hybrid HDI PCB?

Ideal for mixed-signal systems requiring both high-speed digital and RF functionality.

Balances performance and cost by strategically placing Rogers material only where needed.

Enables compact, high-reliability designs for next-generation communication and computing platforms.

Target Applications:

5G RF front-end modules&antennas

Satellite communication systems

Advanced radar and aerospace electronics

High-speed data acquisition systems

Medical imaging and diagnostic equipment