Ceramic PCBs

Ceramic Printed Circuit Boards(Ceramic PCBs)utilize inorganic ceramic materials—such as Aluminum Oxide(Al₂O₃),Aluminum Nitride(AlN),or Beryllium Oxide(BeO)—as the base substrate,replacing conventional organic laminates like FR-4.This fundamental shift in material science enables performance in domains where standard PCBs fail.

Different applications call for specific ceramic formulations and fabrication processes.

Primary Ceramic Materials & Properties:

Core Fabrication Technologies:

● Thick Film Technology: Conductive and resistive pastes(e. g. , silver, gold)are screen-printed onto the ceramic substrate and fired at high temperatures. Ideal for heaters, sensors, and simple circuits.

● Direct Bonded Copper(DBC): A sheet of copper is bonded directly to one or both sides of a ceramic substrate in a high-temperature furnace, creating an oxygen-copper eutectic. The primary method for high-power modules(e. g. , EV inverters)due to its excellent thermal cycling performance.

● Thin Film Technology: Uses vacuum sputtering and photolithography to create ultra-fine features(lines/spaces<25µm). Used for high-frequency circuits, RF MEMS, and precision sensors.

● High/Low-Temperature Co-fired Ceramic(HTCC/LTCC): Ceramic"green tape"is printed with metallic paste, laminated, and co-fired. HTCC uses refractory metals(W, Mo)fired>1600°C. LTCC uses silver/gold pastes fired~850°C, allowing for complex 3D multilayer structures with embedded cavities and passive components.

Ceramic PCBs solve critical challenges in industries where failure is not an option.

Power Electronics&Automotive:

EV/HEV Power Modules: IGBT and SiC/GaN MOSFET substrates in main inverters and DC-DC converters(primarily DBC AlN).

LED Packaging: High-power COB(Chip-on-Board)LED substrates for automotive lighting and projectors.

Aerospace, Defense&RF Communications:

RF&Microwave Circuits: Power amplifier packages, antenna substrates, MMIC carriers up to W-band frequencies.

Phased Array Radar T/R Modules: Require stable electrical properties and thermal management.

High-Rel Avionics: Engine sensors, navigation systems operating in extreme environments.

Industrial, Medical&Semiconductor:

Laser Diode Packages: High-power industrial and medical laser systems.

MEMS&Sensor Packaging: Pressure sensors, accelerometers, flow sensors requiring hermetic seals.

Semiconductor Test&Burn-In: Sockets and probe card substrates for high-temperature testing.

Critical DFM Considerations:

Understand Material Limits: Ceramics are brittle.Minimum corner radii,avoidance of sharp internal angles,and consideration of substrate size vs.thickness ratio are crucial to prevent cracking.

Via&Hole Formation: Holes in ceramics are typically created via laser drilling prior to metallization.Specify hole tolerances and plating requirements(through-hole or blind vias)clearly.

Copper Pattern Design(for DBC): Copper thickness is typically 0.1mm to 0.6mm.Etch factors differ from standard PCBs.Consult us for minimum feature sizes based on your copper thickness.

Metallization&Finish: Specify the bond pad metallization(e.g.,Ni/Au plating over DBC copper for wire bonding or soldering).

Thermal&Mechanical Simulation: Strongly recommended.Model thermal stresses and warpage due to CTE mismatch between ceramic,copper,and attached components.

Our Design Support: Utilize our Free Ceramic PCB Design Consultation.Share your electrical,thermal,and mechanical requirements.Our engineers will recommend the optimal material,technology,and design rules.

We bridge the gap between advanced ceramic material science and reliable,volume-capable manufacturing.

Technology Portfolio:

DBC(Direct Bonded Copper): On Al₂O₃and AlN substrates,up to 0.6mm copper thickness.

Thick Film Ceramics: Single and double-sided circuits,integrated resistors.

Precision Machining: Advanced laser cutting and drilling for complex ceramic shapes and cavities.