Parameter

Standard Capability

Advanced / Custom Capability

Notes & Standards

Number of Layers

1 - 6 layers

Up to 10 layers

Pure flex construction. Adhesiveless build-up recommended for dynamic applications.

Base Dielectric Material

Polyimide (PI)

Other flexible films (e.g., PEN, LCP) upon request

Standard: Dupont™ Kapton® or equivalent. Thickness tolerance typically ±10%.

Base PI Thickness

0.5 mil (12µm), 1 mil (25µm), 2 mil (50µm)

0.4 mil (10µm) to 5 mil (127µm)

Thinner films for higher flexibility; thicker for better dimensional stability.

Copper Foil Type

Rolled Annealed (RA) Copper

Electrodeposited (ED) Copper available

RA copper is standard for superior flex endurance.

Finished Copper Weight

0.5 oz (18µm), 1 oz (35µm)

0.33 oz (12µm) to 2 oz (70µm)

Thicker copper for higher current carrying capacity.

Adhesive System

Acrylic (Standard), Epoxy

Adhesiveless (2-Layer Lamination) recommended for high reliability

Adhesiveless eliminates adhesive flow, offers better thermal & chemical resistance.

Coverlay / Covercoat

Polyimide film with adhesive (photo-imageable available)

Liquid Photo-Imageable Covercoat (LPIC) for fine features

Replaces solder mask. Standard opening tolerance: ±3 mil.

Parameter

Standard Capability

Advanced / Custom Capability

Notes & Standards

Panel Size (Max)

24" x 24" (610mm x 610mm)

Up to 26" x 30" (660mm x 760mm)

For optimal yield and process control.

Board Outline Tolerance

±0.15 mm (±0.006")

±0.10 mm (±0.004")

Via routing, laser cutting, or blanking.

Minimum Bend Radius (Static)

6x total flex thickness

4x total flex thickness (consult required)

Critical for reliability. Depends on materials and layer count.

Minimum Bend Radius (Dynamic)

10x total flex thickness

8x total flex thickness (consult required)

For applications with repeated flexing cycles.

Stiffener Attachment

FR-4, Polyimide, Aluminum, Stainless Steel

Custom thickness & shape. PSA or thermal-bond adhesive.

Used for component support, connector reinforcement, or defined bend areas.

Parameter

Standard Capability

Advanced / Custom Capability

Notes & Standards

Minimum Trace Width

0.075 mm (3.0 mil)

0.050 mm (2.0 mil)

For 1 oz copper on adhesiveless base.

Minimum Trace Space

0.075 mm (3.0 mil)

0.050 mm (2.0 mil)

For 1 oz copper on adhesiveless base.

Etch Tolerance

±0.025 mm (±1.0 mil)

±0.015 mm (±0.6 mil)

Additive to the minimum feature size.

Conductor Thickness Uniformity

≥ 85%

≥ 90%

Measured via cross-section.

Parameter

Standard Capability

Advanced / Custom Capability

Notes & Standards

Drilled Hole (PTH) Diameter (Min)

0.20 mm (8 mil)

0.15 mm (6 mil)

Mechanical drill. Aspect ratio up to 8:1.

Laser Via Diameter (Min)

0.075 mm (3 mil)

0.050 mm (2 mil)

CO2 or UV laser for microvias.

Pad-to-Hole Ratio (Annular Ring)

0.10 mm (4 mil) minimum

0.075 mm (3 mil) minimum

Ensures reliable plating adhesion.

Plating (Hole Wall)

Cu 15µm - 25µm (min)

Cu up to 35µm

Uniform plating is critical for flex reliability.

Finish Type

Standard Thickness

Purpose & Characteristics

ENIG (Electroless Ni/Immersion Au)

Ni: 3-5µm / Au: 0.05-0.10µm

Most common. Flat surface, excellent for fine-pitch components and wire bonding.

Immersion Tin (ISn)

0.8 - 1.2µm

Good solderability, cost-effective. Limited shelf life.

Immersion Silver (IAg)

0.1 - 0.3µm

Excellent solderability, flat surface. Requires anti-tarnish packaging.

OSP (Organic Solderability Preservative)

0.2 - 0.5µm

Inexpensive, flat. For single reflow, limited shelf life.

Electrolytic Hard Gold (Selective)

Au: 0.5µm - 1.27µm (20-50µ")

For high-wear areas (contact fingers). Excellent durability.

Carbon / Silver Paste Print

-

For side-switch or EMI shielding applications.

Test/Inspection Type

Standard Method

Capability / Acceptance Standard

Electrical Test

Flying Probe (100% Netlist)

Fixture-based test for high-volume.

Automated Optical Inspection (AOI)

2D/3D AOI

Detects opens, shorts, and minor surface defects.

Microsection Analysis

IPC TM-650 2.1.1

For process validation & failure analysis (plating quality, layer alignment).

Adhesion Test (Peel Strength)

IPC TM-650 2.4.9

≥ 0.7 N/mm (4 lb/in) for 1 oz Cu (standard).

Solderability Test

IPC J-STD-003

Ensures proper wetting of surface finish.

Flexural Endurance Test

IPC TM-650 2.4.3

Dynamic bending validation per customer specification.

Controlled Impedance Testing

TDR (Time Domain Reflectometry)

±10% tolerance standard. Coupon-based verification.