Category

Standard Capability

Advanced / Specialized Capability

Notes & Standards

Layer Count

1 - 12 Layers

Up to 32 Layers

Prototype to high-volume production.

Standard Board Thickness

0.4 mm - 3.2 mm (0.016" - 0.126")

0.2 mm (Ultra-Thin) to 8.0 mm (Thick Core)

Final thickness tolerance typically ±10%.

Base Material

FR-4 (TG140, TG150, TG170), Halogen-Free FR-4

High-Tg (≥170°C), High-Frequency (Rogers, Taconic, Isola), High CTI (>600V), IGlass, Metal Core (Aluminum), Heavy Copper (≥3oz)

Full range of laminate and prepreg from leading suppliers (Shengyi, ITEQ, Isola, Rogers, etc.).

Copper Foil Weight (Finished)

1 oz (35µm) Inner/Outer, 2 oz (70µm) Outer

0.5 oz (18µm) to 10+ oz (350µm+)

Supports mixed copper weights within a board.

Maximum Panel Size

24" x 24" (610mm x 610mm)

26" x 30" (660mm x 760mm)

Standard panel for optimal yield and process control.

Minimum Single/Double Layer Core

0.05 mm (2 mil)

0.04 mm (1.6 mil)

For sequential lamination builds.

Parameter

Standard Capability

Advanced Capability

Notes

Board Outline Tolerance (CNC Routing)

±0.10 mm (±0.004")

±0.075 mm (±0.003")

For standard complexity profiles.

Board Flatness (Bow & Twist)

≤ 0.75% per IPC-6012

≤ 0.50%

For boards > 150mm.

Edge Roughness (After Routing)

Ra ≤ 3.2 µm (125 µin)

Ra ≤ 1.6 µm (63 µin) with post-processing

Standard routing. Smoother edges available.

Counterbore/Countersink

Supported

Depth control ±0.10 mm

For specific connector or mounting needs.

Parameter

Standard Capability

Advanced Capability

Notes

Mechanical Drill Size (Min)

0.15 mm (6 mil)

0.10 mm (4 mil)

Aspect Ratio up to 15:1.

Laser Drill Size (Microvia)

0.075 mm (3 mil)

0.050 mm (2 mil)

CO2/UV Laser for HDI. Aspect Ratio (1:1 max for capture pad).

Aspect Ratio (Mechanical Drilling)

10:1

15:1

Hole depth vs. drill diameter.

Hole Registration Tolerance

±0.075 mm (±3 mil)

±0.050 mm (±2 mil)

Hole to pattern.

Non-Plated Holes (NPTH) Tolerance

±0.05 mm (±2 mil)

±0.025 mm (±1 mil)

Back-Drilling (Controlled Depth)

Supported

Depth tolerance ±0.15 mm (±6 mil)

For Stub Elimination in high-speed designs.

Parameter

Standard Capability

Advanced Capability

Notes

Min. Trace/Space (Inner Layer)

0.075 mm / 0.075 mm (3/3 mil)

0.050 mm / 0.050 mm (2/2 mil)

For 1 oz base copper.

Min. Trace/Space (Outer Layer)

0.10 mm / 0.10 mm (4/4 mil)

0.075 mm / 0.075 mm (3/3 mil)

For 1 oz base copper.

Min. Annular Ring (PTH)

0.10 mm (4 mil)

0.075 mm (3 mil)

Min. Annular Ring (NPTH)

0.10 mm (4 mil)

0.10 mm (4 mil)

Copper Plating Thickness (Finished Hole)

≥ 20 µm (0.8 mil)

25 - 35 µm (1.0 - 1.4 mil)

IPC-6012 Class 2 standard.

Solder Mask Dam (Between Pads)

0.075 mm (3 mil)

0.050 mm (2 mil)

For LPI Solder Mask.

Finish Type

Standard Thickness / Specification

Key Characteristics & Applications

HASL (Lead-Free)

1 - 40 µm (variable), Flatness per IPC

Economical, robust, good for general purpose. Thermal shock concern for fine-pitch.

ENIG

Ni: 3-5 µm / Au: 0.05-0.15 µm

Flat surface, excellent for fine-pitch BGA, wire bonding, switch contacts.

Immersion Tin

0.8 - 1.5 µm

Excellent solderability, flat, good for press-fit. Limited shelf life.

Immersion Silver

0.1 - 0.4 µm

Excellent solderability, flat, good for high-frequency. Requires anti-tarnish packaging.

OSP (Type 3)

0.2 - 0.5 µm

Low cost, flat, simple process. For quick-turn and single reflow. Limited shelf life.

Electrolytic Hard Gold (Selective)

Au: 0.5 - 2.5 µm (20-100 µin), Ni undercoat: 3-5 µm

Extreme wear resistance for edge connectors, keypads, test points.

ENEPIG

Ni: 3-5 µm / Pd: 0.05-0.2 µm / Au: 0.03-0.05 µm

Superior for multiple reflows and gold/ aluminum wire bonding.

Parameter

Standard Capability

Notes

Type

Liquid Photo-Imageable (LPI), Both Sides

High Tg, Halogen-Free options available.

Color

Green (Standard), Black, White, Blue, Red, Yellow

Other colors upon request.

Min. Web Width (Solder Mask Dam)

0.075 mm (3 mil)

Between SMD pads.

Solder Mask Registration

±0.075 mm (±3 mil)

Relative to copper features.

Legend/Silkscreen Ink Color

White (Standard), Black, Yellow

Epoxy-based ink.

Legend Line Width

0.10 mm (4 mil) minimum recommended

Test Type

Standard Capability

Advanced / Compliance

Electrical Test (E-Test)

100% Flying Probe or Fixture-Based

Netlist verification, continuity & isolation.

Controlled Impedance

±10% tolerance standard (±7% available)

TDR coupon testing. Requires stack-up review.

High Voltage Test (Hi-Pot)

Up to 1500 VDC

For specific safety requirements.

Insulation Resistance

> 500 MΩ (standard)

Per IPC-TM-650 or customer spec.

Dielectric Withstanding Voltage

As per IPC-6012

Current Testing

Custom Load Testing available

For power board validation.

Aspect

Standard / Capability

Primary Quality Standard

IPC-A-600 (Acceptability), IPC-6012 (Performance)

Standard Inspection Class

Class 2 (General Electronic). Class 3 (High-Reliability) upon request.

Inspection Method

Automated Optical Inspection (AOI), Manual Visual Inspection (MVI).

X-Ray Inspection

2D/3D AXI for BGA, QFN, and internal defect analysis (upon request).

Microsection Analysis

Internal lab for process control and failure analysis (FA).

Solderability Testing

Per IPC-J-STD-003 to ensure finish performance.

MSL (Moisture Sensitivity Level)

Baking and dry packaging per IPC/JEDEC J-STD-033.

Certifications (Typical)

ISO 9001:2015, UL Recognized (E-file), RoHS, REACH compliant.