Cost-Effective Standard PCB Manufacturing with Consistent Quality

Quality Control

Our Quality Philosophy: Proactive, Not Reactive

At SENTAK, quality is not a final inspection checkpoint—it is a core discipline integrated into every step of our process. We believe reliability is engineered from the design phase forward, through controlled manufacturing, and verified by objective data. Our goal is Zero Defect Delivery, ensuring your products perform as intended in their end-use environment.

Certified Quality Management System

Our operations are structured within a robust framework recognized by international standards.

ISO 9001:2015 Certified

IPC Standards Compliance

UL Recognized

ISO 9001:2015 Certified

Our fundamental Quality Management System(QMS)ensures consistent processes,continuous improvement,and customer-focused operations.

IPC Standards Compliance

We manufacture and inspect to the latest IPC-6012 (PCB Qualification) and IPC-A-610 (PCBA Acceptability) standards, supporting Class 2 (General Electronics) and Class 3 (High-Performance / Automotive) requirements.

UL Recognized

Our facility holds a UL File Number, and we are experienced in producing UL-certified boards for safety-critical

Multi-Layer Inspection & Testing Technology

We employ a full spectrum of automated and expert inspection tools to capture and prevent defects.

Inspection Stage	Technology / Method	Key Capability & Purpose
PCB Fabrication	Automated Optical Inspection (AOI)	100% layer scan for opens, shorts, and pattern defects.
	Electrical Test (Flying Probe / Fixture)	100% continuity and isolation verification per netlist.
	Impedance Test (TDR)	Coupon-based verification to ensure signal integrity specifications.
	Microsection Analysis	Cross-sectional analysis for plating quality, layer alignment, and via integrity.
SMT Assembly	3D Solder Paste Inspection (SPI)	Pre-reflow measurement of paste volume, height, and alignment to prevent solder defects.
	Automated Optical Inspection (AOI)	Post-reflow check for component presence, polarity, and solder joint quality.
	X-Ray Inspection (AXI)	Mandatory for all BGA/QFN. Examines hidden solder joints for voids, bridging, and ball alignment.
Final Verification	In-Circuit Test (ICT) / Flying Probe	Validates assembly correctness, component values, and basic functionality.
	Functional Test (FCT)	System-level testing under simulated operational conditions per customer specs.

Process Control & Material Assurance

Quality begins with controlled inputs and stable processes.

Supplier Qualification

All key material suppliers (laminates, components, chemicals) are rigorously vetted and periodically audited.

Incoming Material Inspection

Critical materials undergo inspection and testing (e.g., solder paste viscosity, copper clad laminate certification).

MSD&ESD Management

Moisture-Sensitive Devices (MSDs) are stored in controlled dry cabinets and handled per IPC/JEDEC J-STD-033.Full ESD-protected production environment.

Controlled Process Parameters

Solder reflow profiles, plating chemistries,and etching processes are continuously monitored and logged for traceability.

Continuous Improvement & Corrective Action

Our commitment to quality is dynamic and data-driven.

Real-Time Data Collection

Inspection and test data are fed into our MES (Manufacturing Execution System) for real-time SPC (Statistical Process Control) analysis.

Root Cause Analysis(RCA)

For any non-conformance,we employ structured RCA methodologies (e.g.,8D,5 Whys) to identify and eliminate the source.

Customer Feedback Loop

Your feedback is integral to our improvement cycle, ensuring our processes align with your evolving needs.