For Complex & Reliable Interconnect
For Signal Integrity & Speed
For High Power & Harsh Environments
For Innovative Form Factors
PCB Assembly Technologies
PCBA Service Models
Value-Added Services
STENCIL
For Complex & Reliable Interconnect
For Signal Integrity & Speed
For High Power & Harsh Environments
For Innovative Form Factors
PCB Assembly Technologies
PCBA Service Models
Value-Added Services
STENCIL
We'd Love to Hear from You
PRODUCTS & TECHNOLOGY
Frequently Asked Questions
Q: Do you provide Design for Manufacturability (DFM) analysis?
A: Yes, and we strongly recommend it. We provide a free, comprehensive DFM/DFA review for every new project. Our engineers will analyze your Gerber, BOM, and assembly drawings to identify potential issues and suggest optimizations for yield, cost, and reliability before production begins.
Q: What is your minimum component size and finest pitch for SMT assembly?
A: Our standard SMT line can reliably place 01005(0402 metric)and 0201 passive components.For ICs,we handle 0.3mm pitch BGA/CSP/QFN packages as standard,with capabilities down to 0.25mm pitch upon DFM review.
Q: What are your core PCB manufacturing capabilities?
A: We specialize in advanced,high-reliability PCBs.Our core capabilities include:HDI(microvias,3+N+3),Rigid-Flex,Heavy Copper(up to 20oz),High-Tg&Halogen-Free,Metal Core(MCPCB),as well as high-frequency/RF materials(Rogers,Taconic).We also produce high-quality standard multilayer and double-sided boards.
Your Design Deserves Our Discipline.
Partner with a manufacturer where quality is a measurable, managed outcome.