Sentak provides consigned assembly services for electronics manufacturers in small volume NPI format. We have procured seven lines of extremely high end SMT chipshooters, and withour own advanced management system, we build high quality, small to medium lot multispecies high value electronic products. 

We drastically cut cycle time to earn our customers first position at market share!

Our engineering team has extensive experience in DFM/DFA/DFT technologies. SMT, BGA Rework, Re-balling, X-Ray are all readily achieveable. Stencils can 

be cut and delivered inside of 4 hours. 

1.Our PCBA equipment

JUKI-2070LV Chip Mounter 1 set; Reflow Soldering Oven 4 sets

Auto Loader &auto-printing machine 6 sets; Wave soldering oven

ICT machine; AOI Detector 3 sets; Auto Solder Paste Printing Machine 6 sets

FUJI QP42 Chip Mounter 3 Sets; FUJI GP643 Chip Mounter 4 sets

JUKI KE-2050CM Chip Mounter 2 sets; JUKI KE-2060M Chip Mounter 1 set

Auto Picking Machine 3 sets

X-RAY 8200 1 set

Stencil Cleaner 1 set

 2.Manufacturing Productivity

1)SMT productivity: 8 complete automatic SMT production lines, populating 7 million dots per day;

 3.Can Do The Following Components Package

0105, 0201, 0402,0603,0805,1206,2512

QFP,QFN,CSP,TSOP,SOJ,BGA,uBGA,etc

 4.Mounting Operational Capacity Parameters

Pcb layer:1-16layers; Pcb material:FR-4,CEM-1,CEM-3,High TG,FR4 Halogen Free,FR-1,FR-2 

Pcb thickness:0.2mm-7.0mm; Pcb dimension:50*50mm-500*500mm

Copper thickness:0.5oz Min.;5.0oz Max; Chip accuracy:laser recognition±0.05mm;image recognition±0.03mm

Component size:0.6*0.3mm-33.5*33.5mm; Component height:6mm(max)

Pin spacing:laser recognition over 0.65mm;high resolution VCS 0.2mm

Spherical surface spacing:laser recognition over 1.0;high resolution VCS 0.25mm

BGA spherical distance: ≥0.25mm; BGA Globe distance: ≥0.25mm; BGA ball diameter: ≥0.1mm; IC foot distance: ≥ 0.2mm.

SMT Processing Capacity