8-Layer Impedance-Controlled HDI PCB with Resin-Filled Vias

8-Layer Impedance-Controlled HDI PCB with Resin-Filled Vias

Engineered for high-speed,high-reliability applications where signal integrity,surface planarity,and thermal management are critical.

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Key Product Highlights

Precision Impedance Control

Full 8-layer impedance-controlled design ensures consistent signal integrity and minimal reflection for high-speed digital,RF,and differential pair routing.

Fine 3.5/3.8 mil line/space allows precise trace geometry tuning to meet target impedance values(e.g.,50Ωsingle-ended,90Ω/100Ωdifferential).

Enhanced Reliability with Resin-Filled Vias

All vias filled with epoxy resin eliminate air pockets,improve thermal conductivity,and prevent solder wicking during assembly.

Creates a perfectly flat surface—essential for fine-pitch BGA,QFN,and other area-array components.

High-TG Material for Demanding Environments

FR4 with TG>170°C delivers superior thermal and mechanical stability,supporting lead-free soldering and operation in elevated-temperature conditions.

Optimized Layer Stack-up & Construction

1 oz copper on all layers provides uniform current distribution and controlled impedance across the entire stack.

1.6mm finished thickness with 8 layers achieves high routing density while maintaining standard mounting compatibility.

Premium Surface Finish

Immersion Gold(ENIG)with Au>1µ″offers excellent solderability, wire-bond compatibility, and oxidation resistance for long-term reliability.

Why Choose This PCB?

Ideal for high-frequency and high-speed designs requiring strict impedance tolerances and low signal loss.

Resin-filled vias enable higher assembly yields and improve reliability under thermal cycling and mechanical stress.

Combines high layer count,fine features,and robust construction in a standardized thickness.

Target Applications

High-speed networking equipment(routers,switches, servers)

RF communication modules & 5G infrastructure

Advanced computing & data-acquisition systems

Medical imaging & diagnostic electronics

Aerospace & defense radar/control systems