4L TG170 HDI PCB

4-Layer High-TG HDI PCB

Engineered for high-density,high-reliability applications where thermal resilience,signal integrity,and compact form factor are paramount.

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Key Product Highlights

High-Temperature Reliability&Stability

Constructed with FR4 material featuring TG>170°C, ensuring exceptional thermal stability for lead free soldering and reliable operation in elevated-temperature environments.

Advanced High-Density Interconnect(HDI)Capability

4-layer design with ultra-fine 4/3.5 mil line/space enables high component density and precise impedance control in a compact layout.

Laser-drilled micro-vias(0.15mm) support complex routing and shorter signal paths,enhancing electrical performance.

Ultra-Slim Profile without Compromising Performance

Finished board thickness of only 0.8mm provides a lightweight,space-saving solution ideal for slim and portable electronic devices.

Balanced layer stack-up ensures mechanical robustness and reliable interconnection in constrained designs.

Premium Surface Finish for Superior Solderability

Immersion Gold(ENIG)with Au>1µ″delivers a flat,oxidation-resistant surface that ensures reliable solder joints,excellent wire-bond compatibility,and extended shelf life.

Why Choose This PCB?

Ideal for applications requiring both high thermal endurance and high circuit density.

Enables miniaturization without sacrificing layer count or electrical performance.

Supports advanced packaging and fine-pitch components with its HDI micro-via and fine-line capabilities.

Target Applications

Automotive control modules(ECU,sensor nodes)

Industrial automation&motor drives

High-temperature medical devices

Compact power supplies&converters

Dense consumer electronics(wearables,miniaturized IoT devices)