4-Layer Polyimide PCB with Heavy Selective Gold Plating (30µ″)

Engineered for extreme environments and high-reliability interconnects.

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Key Product Highlights

Premium Polyimide Material

Built with Polyimide substrate—excellent thermal stability, flexibility, and resistance to high temperatures, chemicals, and mechanical stress.

Ideal for aerospace, military, medical, and automotive applications where durability under harsh conditions is critical.

Advanced Selective Heavy Gold Plating

Selective Gold Plating up to 30µ″on key contact areas—provides superior wear resistance,low contact resistance,and reliable performance for frequent mating cycles.

Remaining surface finished with ENIG(1µ″)—ensures excellent solderability and oxidation resistance across the board.

Perfect for connectors,test points,and edge contacts that require long-term reliability.

Robust Construction&Design Flexibility

4-layer design with balanced 1oz copper each layer—supports stable power distribution and signal integrity.

Board thickness:1.65mm—sturdy yet suitable for both rigid and flex-rigid applications.

Min.hole size:0.4mm and min.trace/space:30/12 mil—accommodates robust designs and ease of manufacturing without compromising performance.

Why This PCB Stands Out

Heavy gold plating(30µ″) Extends connector life and ensures stable electrical performance in dynamic or corrosive environments.

Polyimide core allows operation in high-temperature and high-stress conditions where standard FR4 would fail.

Combines selective thick gold with ENIG—The best of both worlds for contact reliability and assembly ease.

Combines selective thick gold with ENIG

Aviation and drone control systems

Medical implantable or diagnostic devices

Automotive sensor and control modules

High-vibration industrial equipment

Test and burn-in sockets