2 Layer High Density Flex PCB

2-Layer High-Density Flexible PCB with Ultra-Fine Features&Integrated Rigid Support

Engineered for advanced applications requiring exceptional circuit density,reliable dynamic flexing,and robust assembly in a single,compact construction.

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Key Product Highlights

Ultra-High-Density Flexible Circuitry

Extremely fine 0.05 mm(≈2 mil)line/space enables complex routing and miniaturized component integration,supporting advanced packaging and space-constrained designs.

0.1 mm laser-drilled micro-vias facilitate high-density interconnections while maintaining the integrity and flexibility of the polyimide base material.

Optimized Copper Construction for Signal Integrity

8µm(≈0.2 oz)copper on both layers provides an ideal balance between electrical performance and flex durability,suitable for controlled impedance and high-speed signal applications.

Hybrid Rigid-Flex Design with Integrated Stiffener

FR4 stiffener laminated to the bottom layer offers localized rigidity for secure component mounting,connector stability,and improved handling,without compromising the overall flexibility of the circuit.

Polyimide base material ensures excellent thermal resistance,mechanical durability,and reliable performance across repeated bending cycles.

Reliable Surface Finish

Immersion Gold(ENIG) provides a flat,solderable,and oxidation-resistant surface,ensuring high assembly yield and long-term connection reliability.

Why Choose This PCB?

Ideal for applications demanding both high circuit density and reliable flexing in compact or moving assemblies.

Integrated stiffener eliminates the need for secondary support structures, simplifying assembly and reducing overall part count.

Suitable for dynamic,high-vibration,or space-constrained environments where electrical performance and mechanical endurance are critical.

Target Applications

High-density wearable medical devices and health monitors

Compact consumer electronics(foldable displays,miniature cameras)

Aerospace and drone avionics with strict weight and space limitations

Advanced automotive sensors and flexible control modules

Precision industrial robotics and compact instrumentation