10L IT180 High-Frequency PCB

Key Product Highlights

Advanced High-Density Interconnect(HDI)Design

10-layer construction with IT180 FR4 material,ideal for high-speed and high-frequency applications.

HDI technology enables compact,lightweight,and high-performance PCB solutions.

Precision Engineering&Superior Layer Stack-up

Controlled copper thickness distribution:1/1/1/1/2/2/H/H/1/1 oz,optimizing signal integrity and power delivery.

Finished board thickness of just 1.71mm—perfect for space-constrained and slim designs.

Ultra-Fine Circuitry&Micro-Drilling

Min.line width/space: 4.9/4 mil,supporting complex routing and high component density.

Min.drill size: 0.1mm, allowing for micro-vias and enhanced interlayer connections.

Premium Surface Finish

Immersion Gold(ENIG)with 1μ″gold thickness,ensuring excellent solderability,flat surface,and robust corrosion resistance.

Why Choose This PCB?

Ideal for high-speed digital,RF,and communication devices.

Supports miniaturized and high-reliability designs in aerospace,medical,automotive,and telecom.

Combines performance,precision,and durability in one advanced package.

Perfect For

5G infrastructure

Advanced computing systems

Medical imaging and diagnostics

Automotive control units

High-frequency test equipment